After the summer hiatus of trade shows and conferences, Excool made a highly anticipated return at DCD Connect London. The event, held at the Business Design Centre, demonstrated the substantial growth and interest in the sector over the last 3 years, leading to the expansion of venues.
Data center cooling plays a pivotal role in data center design, and Excool, with 14 years of experience in the field, showcased its expertise in indirect adiabatic cooling, indirect evaporative cooling, liquid cooling, chillers, fan walls, as well as the latest technology of CDUs (Coolant Distribution Units).
Excool’s presence at DCD Connect sparked significant engagement, particularly regarding their CDU, as conversations revealed how Excool can contribute to AI cooling for enhanced effectiveness and sustainability.
Key features of the Excool CDU, tailored to meet the high-density cooling needs for chips, include:
Capacity up to 1500kW at a 4°C approach temperature, depending on specific technical requirements
- Standard dimensions of 1200 x 1200 x 2038
- N+1 secondary pumps
- 2-port valve for secondary fluid temperature control
- In-built buffer tank for system pressurization and leak detection
- Parallel 25 or 50 micron secondary side filtration
- Optional 500 micron primary side filtration
- Standard in-built controls UPS and dual power feed ATS
- Compatibility with propylene and ethylene glycol coolant mixes on both primary and secondary sides
- Versatile installation in the white space or in a mechanical corridor
For further information, inquiries can be directed to info@excool.com.
